Indium Corporation^®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, received a Mexico Technology Award in the solder paste category for its Indium12.9HF, a no-clean, halogen-free solder paste designed to meet the growing challenges of high-density, fine-pitch assemblies. The award was presented at a breakfast event prior to the SMTA Guadalajara Tech Forum and Expo in October.

As fine-aperture print transfer efficiency becomes increasingly critical, Indium12.9HF helps PCB manufacturers keep pace with rapid industry miniaturization. Its strong oxidation resistance allows it to withstand soak profiles often required for large, thermally massive assemblies, as well as helps reduce the risk of HIP, NOW, and bridging defects. It delivers best-in-class voiding performance on OSP and ENIG surfaces and demonstrates high oxidation resistance, with little to no graping or solder balling on pads as small as 175 microns.

“Indium12.9HF enables consistent solder volume deposition to form high-quality, long-lasting solder joints, and reduces printing-related defects such as insufficient solder and opens,” said Tim Twining, Indium Corporation Vice President of Sales, Marketing, and Technical Service. “This consistency helps PCB manufacturers improve first-pass yield and achieve cost savings through reduced scrap rates and improved cycle times.”

Sponsored by Mexico EMS magazine, the Mexico Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries over the past year. The judging process is conducted by a panel of independent judges.