SEC has begun expanding into the semiconductor back-end processing market.

The company said on Oct. 16 it will supply its Semi-Scan Wafer inline X-ray inspection system to a mass-production line operated by a global outsourced semiconductor assembly and test (OSAT) provider. This marks the first commercial deployment of the equipment since its development was completed in the first quarter of this year.

Initial units are expected to be delivered soon, with supply volumes projected to increase. The equipment is priced at approximately 2 billion won per unit.

Semi-Scan Wafer is designed for wafer-level packaging (WLP) production lines. It uses nondestructive inspection to detect defects in microbumps and internal bonding structures. The system can also be used to inspect high-bandwidth memory (HBM) stacking processes.

WLP involves electrical interconnection and packaging of semiconductors at the wafer level. The technology is used to integrate components such as HBM and graphics processing units (GPUs).

"We will use this first commercial order as a foundation to secure additional global customers," SEC said, adding that it plans to develop HBM and advanced packaging inspection equipment into core growth drivers. The company also said it is expanding production lines for the same customer and has completed preparations to increase supply.